Xiaomi has unveiled three new in-house chips designed for smartphones. The lineup includes the Xring O3, Xring O100, and Xring D100.
The Xring O3 is the company’s latest flagship mobile processor and the successor to the Xring O1. Built on TSMC’s 3nm process, it features a 10-core CPU and a 16-core Arm G2-Ultra NX GPU.
Xiaomi claims the Xring O3 achieved an AnTuTu score of 5.22 million, making it the first mobile chip to pass the 5-million mark. The company also claims up to 60% higher CPU performance, up to 85% better GPU performance, and 64% improved power efficiency.
The Xring O3 supports LPDDR6 memory with bandwidth of up to 113.8GB/s. It also includes Xiaomi’s in-house NPU, which offers up to 200 TOPS of AI performance.
Xiaomi has confirmed that the Xring O3 will power the upcoming Xiaomi 18 Fold and Xiaomi Pad 9 Pro Max, both expected to launch in China in September.
Meanwhile, the Xring O100 is a 6nm chip focused on AI computing. The company plans to use it for on-device AI applications across smartphones, vehicles, and robots.
The Xring D100, on the other hand, is designed for intelligent driving. It is a 3nm automotive AI chip featuring a 20-core CPU and 16-core NPU. Xiaomi says it supports up to 160GB of unified memory and can run AI models with up to 200 billion parameters locally.
Development of the Xring D100 has been completed, with commercial availability planned for 2027.
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