The company’s new mid-range chipset prioritizes gaming and photography, two of consumers’ most desired features.
Taiwan Semiconductor Manufacturing Company (TSMC) uses the N4P process to build the MediaTek Dimensity 7200 SoC.
Related: MediaTek Announces Dimensity 9200
It has two 2.8GHz Cortex-A715 cores and six 510 cores. Mali G610 MC4 GPU handles visuals. It supports 144Hz Full HD, HDR10+, CUVA HDR, and Dolby HDR.
MediaTek HyperEngine 5.0 supports AI-based Variable Rate Shading, UFS 3.1 storage for quicker loading, and RAM up to 6,400Mbps (LPDDR5). The SoC has a 14-bit HDR ISP for 4K HDR video capture, a 200MP primary camera, and two Full HD video streams.
APU enables AI-powered camera upgrades like Real-Time Portrait Beautification. The chipset supports 2CC Carrier Aggregation, Dual SIM 5G, triband Wi-Fi 6E, Bluetooth 5.3, and 5G sub-6GHz with 4.7Gbps downlink.
No smartphone brand has declared that MediaTek Dimensity 7200 will release in smartphones in the first quarter of this year. Brands will introduce smartphones using this new chipset in two weeks.