Asus continues to stay quiet despite the noise made by foldable phones from Samsung and Huawei. But no worries as they recently released the Asus Zenfone Max Shot and Max Plus M2 in Brazil, featuring the unfamiliar Snapdragon SiP 1 chipsets.
SiP or System-in-Package is a different type of SoC design. It’s supposedly a better design approach to mobile processors by having a single circuit for most major components, if not all. It allows engineers to save more space for other parts such as the battery, under-screen fingerprint scanner, and wherever imagination takes you.

Asus Zenfone Max Shot (left) has a triple camera set up while the Max Plus M2(right) replaces the third sensor with an LED flash
Although we are unsure how the new design will pan out in the next few years, it only makes sense when we are seeing absurdly high MP count on smartphone cameras. Not to mention, the engineering design made for the foldable phones.
While it seems like an interesting improvement for mobile chipsets, the performance doesn’t veer away from the Snapdragon 450 due to its 1.8GHz octa-core CPU and Adreno 506 GPU based on the 14nm process node.
As for the rest of the specs, you, be the judge.
The Asus Zenfone Max Shot highlights a triple-rear camera setup (12MP main + 8MP ultrawide + 5MP depth-sensing) while the Zenfone Max Plus M2 makes do with a 12MP main + 5MP depth sensing combo. Both, however, have the same 8MP selfie snapper.
No gradient hues can be seen here as both feature aluminum designs. The latest Asus mid-range phones even come with micro USB ports but with generous 4000mAh batteries. Both again run on Android 8.1 Oreo but the company promised Pie update in the upcoming months.
Both the Zenfone Max Shot(3GB/32GB) and Max Plus M2(3GB/32GB) are available in Brazil with prices of BRL 1,349 (~$350 or Php18,500) and BRL 1,299 (~$340 or Php18,000), respectively. Further, the former goes up to BRL 1,699 (~$445 or Php23,500) for the 4GB/64GB variant.
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