The Samsung Galaxy S9 and S9+’s mass production is reported to start next week and according to a South Korean publication, the company has started receiving parts for the building of the newest smartphones from its suppliers. The report also claims that it will be launched in late February and will be hitting the market by early March.
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The South Korean company has started receiving the stacked circuit board called SLP (Substrate Like PCB), it’s a system board design that will hold the chips tightly so that adequate space is available for other larger components like the batteries.
Unfortunately, as confirmed by the recent report, that the dual camera setup will only be on the larger variant which is the Galaxy S9+. As what we said a few days ago, the product manufacturers also stated that the Galaxy S9 case is Touch ID Fingerprint & Face ID compatible. Like the Galaxy S6, the rugged waterproof case supports wireless charging.
Both the Samsung Galaxy S9 and S9+ are expected to be launched in Barcelona, Spain through the Mobile World Congress 2018 (MWC 2018) in February.
