Samsung is actively exploring the integration of 3D Chiplet technology to enhance the productivity of its Exynos chipsets, according to reports shared on X.
This next-gen packaging technology offers advantages like reduced package size, improved bandwidth, and enhanced power efficiency.
While there are challenges in commercialization, the move towards chiplets is seen as crucial as traditional front-end process technology approaches its physical limits.
3D packaging technology offers benefits over traditional monolithic methods. Chiplets can boost yield by allowing the replacement of only the affected component, unlike monolithic chips where the entire chip must be discarded in case of a problem. Additionally, chiplets streamline the design process, as changes can be made to specific circuits without having to redesign the entire chip.
This shift to chiplets is strategic for Samsung, facing stiff competition in the mobile AP market. Qualcomm leads the market share, with Apple and MediaTek following closely.
Samsung’s Exynos APs have faced challenges, leading to the use of Qualcomm’s Snapdragon 8 Gen 2 chip in its flagship Galaxy S23 smartphone series.
The adoption of 3D chiplets could set Samsung’s Exynos APs apart. Vertical stacking of chips in 3D packaging reduces overall package size and enhances bandwidth and power efficiency. This move aims to make Exynos APs more competitive against Qualcomm and Apple offerings.
Samsung is not alone in exploring chiplet technology. NVIDIA, AMD, and Intel are also incorporating chiplets in the development of high-performance computing (HPC) system semiconductors.
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