Taiwan Semiconductor Manufacturing Co. (TSMC) is reportedly exploring plans to produce advanced memory chips called 3D DRAM, potentially expanding its business beyond semiconductor manufacturing.
According to a report by The Information, cited by Reuters, TSMC began considering the move at the request of NVIDIA, its biggest customer. The plan could help address the growing demand for memory chips driven by artificial intelligence (AI).
TSMC is also reportedly considering building new factories for memory production or acquiring an existing facility and converting it for DRAM manufacturing. However, it has not announced a production timeline.
The reported project is being led by Hsu Kuo-chin, a TSMC vice president overseeing advanced packaging, according to The Information.
The move could put TSMC in competition with established memory manufacturers Samsung Electronics, SK Hynix, and Micron, which are also developing 3D DRAM technology.
TSMC has not confirmed whether it will proceed with the project.