Meizu 15 Plus image leak showing ultra-thin bezels

Meizu launched the M6S  last week, and now everyone’s eyes are on the Meizu 15 Plus as a new image surfaced. As we can see from the attached image, it will come with very thin bezels on three sides, with the top one being a bit thicker to house the camera and sensors.

Also, it was mentioned that the new Meizu flagship will have Snapdragon 845 or Exynos 8895. The leaked sketch of the back portion of the smartphone suggests that it’s going to have a dual camera setup with an LED flash and laser AF sensor below, similar to the Meizu Pro 6 Plus.

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The sketch of the back panel of the smartphone also confirms that the fingerprint scanner won’t be placed at the back, it might be located on the side, which has already been done to the Meizu M6S.

According to the company founder Jack Wong, the phone will arrive for the holiday and will be on sale in March. It may come with a price tag of CNY3,599, which currently translates to $560.

 

 

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