Recently, Taiwanese semiconductor company MediaTek unveiled its latest system-on-chips (SoCs), the Dimensity 8100, Dimensity 8000, and Dimensity 1300. They are aimed to bring flagship-level performance for smartphones.
Both the MediaTek Dimensity 8100 and Dimensity 8000 are built on the ultra-efficient TSMC 5nm production process with an octa-core CPU.
The Dimensity 8100 integrates four Arm Cortex-A78 cores with speeds reaching 2.85GHz, and the Dimensity 8000 has four Cortex-A78 cores operating at up to 2.75GHz. They are equipped with Arm Mali-G610 MC6 GPU with MediaTek’s HyperEngine 5.0 gaming technologies for improved power efficiency that extends playtime and frame rate stability – 170fps for the Dimensity 8100 and 140fps for the Dimensity 8000.
The new Dimensity 8000 series also uses MediaTek’s Open Resource Architecture to give device makers the flexibility to customize and differentiate features. They also integrate fifth-generation AI Processing Unit, APU 580 aiming balance toward performance and power efficiency.
Furthermore, these chips support LPDDR5 and UFS 3.1 memory, as well as a five gigapixel per second image signal processor (ISP), up to 200 MP cameras and 4K60 HDR10+ videography, Wi-Fi 6E, and Bluetooth 5.3.
Other features of the Dimensity 8000 series include the company’s latest noise reduction and AI-based unblur techniques in extremely low-light environments, a 3GPP R16-ready 5G modem to boost sub-6GHz performance using 2CC Carrier Aggregation, and simultaneous dual-camera HDR video recording which allows the users to record with the front and rear cameras or two different rear lenses.
“You could say the MediaTek Dimensity 8000 series is the little brother to our flagship Dimensity 9000 chip. Meaning it brings flagship grade features and next level energy efficiency to the premium smartphone market,” said CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit.
There’s also the MediaTek Dimensity 1300 that is built on a 6nm process. It comes with an octa-core CPU that integrates an ultra-core Arm Cortex-A78 clocked up to 3GHz, three Arm Cortex-A78 super cores, and four Arm Cortex-A55 efficiency cores. In addition, it also has an Arm Mali-G77 GPU and MediaTek APU 3.0.
the Dimensity 1300’s HDR-ISP supports up to 200MP, and integrates MediaTek’s HyperEngine 5.0 to offer an optimal balance between performance and power for better efficiency in gaming and daily use scenarios. It comes with new AI enhancements, improving night shot photography and HDR capabilities for great image clarity.
Smartphones powered by the Dimensity 8100, Dimensity 8000, and Dimensity 1300 will be available in the market in the first quarter of 2022.
