Alongside the iPhone 18 Pro variable aperture insight, Apple analyst Ming-Chi Kuo also shared the Apple M5 series early details including its performance and production timeline.
The Apple M4 chips are now available on the latest Macs and the upcoming M5 lineup next year is said to utilize TSMC’s cutting-edge N3P (3nm) manufacturing node, which promises superior performance and power efficiency (5-10% lower power consumption and 5% higher performance) over their M4 predecessors.
Kuo also highlighted that the M5 Pro, M5 Max, and M5 Ultra variants will deliver server-grade System on Integrated Chips (SoIC) design. It will feature 2.5D packaging technology known as SoIC-mH.
This will improve thermal performance and reduces throttling during demanding operations while taking up to 50% less space than conventional SoC designs.
Additionally, Apple will also allegedly separate its CPU and GPU designs in the M5 lineup, which will potentially increase performance.
Meanwhile, the production timeline of the M5 series chips will likely follow a similar pattern like the M4 series.
The base M5 chip mass production is expected in the first half of 2025, while the M5 Pro and M5 Max chips in the second half of 2025. The M5 Ultra is expected to arrive in 2026.
Further details are yet to be revealed. Stay tuned for more updates.
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