A few weeks after the launch of the K50 Gaming/K50G smartphone, Xiaomi sub-brand Redmi recently announced that the K50 Pro and K50 Pro+ will go official on March 17.
Ahead of its launch, the brand has revealed the smartphones’ back design and some of the key features.
The teaser images revealed that the Redmi K50 Pro and K50 Pro+ will sport a different design. Both will feature a new “nano-microcrystalline” back design with sparkling ice-crystal elements. They will also come with triple-rear cameras with one of them being a 108MP main sensor.
For the chipsets, the Redmi K50 Pro will sport the latest MediaTek Dimensity 8100 chip while the Redmi Pro+ will be powered by the MediaTek Dimensity 9000 processor. In addition, the Redmi K50 Pro was recently spotted in Geekbench with 12GB of RAM and Android 12 out of the box and scored 932 in Single-Core and 3690 in Multi-Core.
The Redmi K50 series will also be the first smartphones to support Bluetooth 5.3, which improves latency, power consumption and range. They will also come with LC3 audio codec which aims to improve wireless audio streaming quality, as well as dual-band GPS and IR blaster.
Other details of the smartphones are yet to be revealed, so stay tuned for more updates.
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