MediaTek has unveiled the Dimensity 7300 and Dimensity 7300X, two advanced 4nm chips tailored for cutting-edge mobile devices. These chips offer top-notch power efficiency and performance, making them ideal for multitasking, photography, gaming, and AI tasks.
Both chipsets feature an octa-core CPU with four powerful Arm Cortex-A78 cores and four energy-efficient Arm Cortex-A55 cores. With a 4nm process, they consume up to 25% less power than their predecessors. The CPUs are complemented by the latest Arm Mali-G615 GPU and MediaTek HyperEngine optimizations, delivering 20% faster FPS and improved energy efficiency for gaming.
The new Dimensity series also enhances gaming with smart resource management, optimized 5G and Wi-Fi connections, and support for Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.
For photography enthusiasts, the chipsets come with the MediaTek Imagiq 950, enabling premium-grade imaging with a 200MP main camera support. The AI performance is doubled, and mixed precision data types are introduced to efficiently utilize memory bandwidth.
With MiraVision 955, the Dimensity 7300 SoCs support detailed WFHD+ displays with 10-bit true color and global HDR standards. The Dimensity 7300X is geared towards dual-display flip phones, meeting the demand for innovative form factors.
Other notable features include MediaTek 5G UltraSave 3.0+ technology for power efficiency, support for fast 5G downlink speeds, Wi-Fi 6E connectivity, and dual 5G SIM support with dual VoNR.
ManilaShaker is a tech media producing insightful and helpful content for our local and growing international audience. Our goal is to create a premier Philippine digital consumer electronics resource that provides the most objective reviews and comparisons globally.
