Samsung recently unveiled its latest LPDDR5X DRAM chip, the thinnest in its category, for smartphones.
The company has begun mass production of the 12nm chip. It is available in 12GB and 16GB LPDDR5X DRAM packages made for the low-power DRAM market, especially smartphones with on-device AI capabilities.
The chip is 0.65 mm thin and incorporates a 4-stack structure. It is approximately 9% thinner compared to the previous generation and heat resistance is improved by about 21.2%, Samsung claims.
Through the optimization of printed circuit board (PCB) and epoxy molding compound (EMC) techniques, the new LPDDR DRAM package measures to that of a fingernail. To reduce the package height, Samsung uses an optimized back-lapping process.
According to Samsung, the brand plans to keep growing the low-power DRAM market by providing mobile processor and device makers with its 0.65mm LPDDR5X DRAM. With the increasing demand for high-density, high-performance mobile memory solutions in smaller package sizes, the company intends to create the thinnest LPDDR DRAM packages for future devices by developing 6-layer 24GB and 8-layer 32GB modules.
You can check out Samsung’s official Newsroom for more information.
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