
HONOR has officially teased the arrival of its latest flagship, the HONOR Magic V3, set to debut on July 12 in China.
The newly released poster, showcases a leather-finished back panel designed to offer a premium feel and improved grip. The standout feature is its prominent round camera module, encircled by an octagonal metallic gold border and housing a sophisticated camera setup, including a periscope telephoto lens for enhanced photography capabilities.
Inside, it is expected to feature the Snapdragon 8 Gen 3 chipset, ensuring robust performance. Reports hint at support for 66W fast charging and satellite connectivity, catering to modern connectivity needs.
Stay tuned for further updates as HONOR prepares to reveal more details about the HONOR Magic V3 and its accompanying lineup on July 12.
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