HONOR Teases Magic V3 in New Poster

HONOR has officially teased the arrival of its latest flagship, the HONOR Magic V3, set to debut on July 12 in China.

The newly released poster, showcases a leather-finished back panel designed to offer a premium feel and improved grip. The standout feature is its prominent round camera module, encircled by an octagonal metallic gold border and housing a sophisticated camera setup, including a periscope telephoto lens for enhanced photography capabilities.

ms x dost

Inside, it is expected to feature the Snapdragon 8 Gen 3 chipset, ensuring robust performance. Reports hint at support for 66W fast charging and satellite connectivity, catering to modern connectivity needs.

HONOR Magic V3 Rumored Specs

Honor Magic V3
  • Chipset: Snapdragon 8 Gen 3
  • Network: Satellite Communications
  • Expandability: Up to 1TB
  • Triple Main Camera: 50MP main | Periscope Telephoto |
  • Charging: 66W

Stay tuned for further updates as HONOR prepares to reveal more details about the HONOR Magic V3 and its accompanying lineup on July 12.

    Leave a Reply

    Your email address will not be published. Required fields are marked *

    This site uses Akismet to reduce spam. Learn how your comment data is processed.

    ManilaShaker is a tech media producing insightful and helpful content for our local and growing international audience. Our goal is to create a premier Philippine digital consumer electronics resource that provides the most objective reviews and comparisons globally.